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Bonded!

Company News Thursday, June 24, 2010: Fastening and Assembly Solutions

With manufacturing output up at last, many manufacturers are now looking to discover new and innovative ways to design and produce goods for the recovery.

IASE – the Industrial Adhesives, Sealants and Encapsulants Exhibition – provides a route for alternative high performance bonding solutions. Adhesives technologies have a proven track record in replacing – and complementing - mechanical fixing methods, often with better performance at lower cost. And thanks to adhesives, many manufacturers have the ability to enable assemblies that would simply not be possible any other way.

IASE – the Industrial Adhesives, Sealants & Encapsulants Exhibition – supported by BASA (British Adhesives and Sealants Association) – showcases the latest advances in the fast-moving field and offers engineers and buyers of every discipline across all manufacturing industries instant access to ideas, innovation and advanced production methods now available with 21st Century adhesives capability.

An exhibitor portfolio including some of the world’s leading authorities on adhesives technology are demonstrating their skills, products and application successes at IASE, offering manufacturing professionals access to real problem-solving solutions, answers and ideas in the space of just a few hours.

The exhibition is being held at the centrally located National Motorcycle Museum, adjacent to the NEC, and is open from 10am to 3pm. The Museum offers abundant free parking immediately outside the exhibition entrance, and the Organisers are providing Complimentary Luncheon Vouchers worth £5 and Complimentary Museum passes worth £6.95 for qualifying visitors who register in advance. To take advantage of these special offers visitors need to be currently employed manufacturing professionals involved in design, production, purchasing or manufacturing management. Visitors will also have access to the successful FAST (Fastening & Assembly Technology) Exhibition at the same event.