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Supreme 10AOHT-LO: NASA Low Outgassing, Cryogenically Serviceable Epoxy

Product News Monday, July 1, 2013: Master Bond Inc

One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance Up to 400°F as well as High Thermal Conductivity and Excellent Electrical Insulation Properties. Meets NASA Low Outgassing Specifications & Cryogenic Serviceability.

Master Bond Polymer System Supreme 10AOHT-LO has an excellent balance of optimal performance properties including both high shear and high peel strength, along with high thermal conductivity and excellent electrical insulation properties. This one component adhesive system is formulated to cure at elevated temperatures, e.g. 1 hour at 250°-300°F. The tensile lap shear strength is greater than 1500 psi. No mixing is necessary prior to use. Master Bond Polymer System Supreme 10AOHT-LO produces good bonds for service in the remarkably wide temperature range of 4K to 400°F. It offers superior resistance to impact, thermal shock and vibration while maintaining the moisture and temperature resistance typical of epoxy resin adhesives. It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer System Supreme 10AOHT-LO produces durable high strength, thermally conductive, exceptionally tough bonds which are remarkably resistant to severe thermal cycling and many chemicals including water, oil and fuels. Adhesion to metals, glass, ceramics, and many plastics is excellent. The hardened adhesive is a superior thermal conductor and its color is gray. Master Bond Polymer System Supreme 10AOHT-LO offers the convenience of a heat cure with no mixing prior to use and a uniquely favorable bonding performance for even the most difficult applications in the aerospace, electronic, computer, appliance and chemical industries. Supreme 10AOHT-LO meets NASA low outgassing specifications.